[sdiy] ODP: Question for the self-assembly SMD-ers here

Mike Bryant mbryant at futurehorizons.com
Fri Feb 18 20:16:05 CET 2022


I wonder if I put a via right under every pad (and lots under the large pads) I could flow solder through it ?

From: The SynthiMuse [mailto:synthimuse at gmail.com]
Sent: 18 February 2022 18:56
To: Roman
Cc: synth-diy at synth-diy org; Mike Bryant
Subject: Re: [sdiy] ODP: Question for the self-assembly SMD-ers here

Not sure what the footprint guidelines for this part are but I would arrange my footprint to have a few vias under the large pads and plan to apply hot air from below to flow solder paste on to all the pads.

On Fri, 18 Feb 2022, 18:47 Roman, <modular at go2.pl<mailto:modular at go2.pl>> wrote:

Yes, it is doable with soldering iron. Sharp chisel or knife type, with flux gel and microscipe. No way of course to solder botom pads, so it will be poorly heatsinked. But I guess for a prototype you won't be driving it full power anyway.

You might also try solder paste and hot air, but IMHO that's more risky and difficult.

I'm not inUK so can't help you, although I'd gladly do it for free.


---- Użytkownik Mike Bryant napisał ----
Is it possible to assemble this product by hand ?


I can get a PCB made at JLCPCB with all the support circuitry on it and leave plenty of space for this IC, but not sure if it’s possible to assemble this part afterwards.
It has a recommended stencil design in the datasheet which seems pretty tight for manual placement.

Alternatively anybody in the UK with whatever equipment is needed and willing to do it (paid for obviously) please email me.

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