[sdiy] SSM2164 Obsolescence Update

karl dalen dalenkarl at yahoo.se
Fri Jun 10 17:23:32 CEST 2011


What about doing some NEW designs instead of recycling? 

KD

> Harry Bissell <harrybissell at wowway.com>:
> (now if we could get the CA3280 back... :^)
> 
> H^) harry
 
> ----- Original Message -----
> From: Dan Snazelle <subjectivity at hotmail.com>
> To: Neil Johnson <neil.johnson97 at ntlworld.com>
> Cc: synth-diy at dropmix.xs4all.nl
> Sent: Fri, 10 Jun 2011 09:04:06 -0400 (EDT)
> Subject: Re: [sdiy] SSM2164 Obsolescence Update
> 
> So it sounds like the chip became too popular too fast?
> Weird
> 
> 
> 
> 
> Sent from my iPhone
> 
> On Jun 10, 2011, at 8:56 AM, Neil Johnson <neil.johnson97 at ntlworld.com>
> wrote:
> 
> > All,
> > 
> > Latest update in my conversation with ADI.
> > 
> > Miracles do happen!  Fingers-crossed the test
> wafers work out well.
> > 
> > Neil
> > 
> > ---------- Forwarded message ----------
> > Date: Fri, 3 Jun 2011 04:49:26 -0400
> > Subject: SSM2164 Obsolescence Update (SR#: 1125382)
> > 
> > 
> > 
> > As part of a planned shutdown of ADI's West Coast
> fabs, a very long
> > term supply SSM2164 die inventory was built. 
> Periodically, the status
> > of this
> > inventory is tested against market demand.  For
> many years supply was
> > meeting demand in a predicted fashion.  In the
> past year demand of
> > this part has
> > increased dramatically to the point that we needed to
> declare the part
> > obsolete on a timeline that is shorter than ADI's
> usual practice.  We
> > apologize
> > for the trouble this causes and commit the resources
> of the DAU
> > product line to help you get through this pain.
> > 
> > Since the product discontinuation notice was issued,
> the DAU product
> > line has continued to look for a wafer process that
> would be capable
> > of
> > manufacturing the SSM2164 design.  We have
> identified an alternate
> > wafer processing capability and have initiated a pilot
> run of the
> > SSM2164 design.
> > The initial evaluation of the new wafer processing
> capability will be
> > used to determine the additional effort required to
> re-establish the
> > manufacturing capability for the SSM2164 and is
> planned to be
> > completed by September 1, 2011.  At that time, a
> determination will be
> > made to initiate
> > a PCN to notify customers of a change in wafer
> processing location, or
> > we will discontinue our efforts to re-establish a
> wafer process for
> > the
> > SSM2164.  Our current plan (if the wafer process
> is a success)
> > includes a revision to the pilot silicon and we would
> estimate
> > re-establish our
> > manufacturing capability for the SSM2164 by April 1,
> 2012.
> > 
> > An update of the SSM2164 evaluation will be
> forthcoming in September.
> > 
> > Best regards,
> > Igor Tomic
> > Analog Devices
> > Customer Interaction Center



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